Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538762 | Methods for making double-sided semiconductor devices and related devices, assemblies, packages and systems | — | 2022-12-27 |
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Xiaopeng Qu, Brandon P. Wirz, Andrew M. Bayless | 2022-11-29 |
| 11444037 | Semiconductor devices having crack-inhibiting structures | Sheng-Wei Yang, Shams U. Arifeen | 2022-09-13 |
| 11419239 | Thermal management of circuit boards | Xiaopeng Qu | 2022-08-16 |
| 11385281 | Heat spreaders for use in semiconductor device testing, such as burn-in testing | Xiaopeng Qu, Amy R. Griffin | 2022-07-12 |