Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Hyunsuk Chun, Brandon P. Wirz, Andrew M. Bayless | 2022-11-29 |
| 11419239 | Thermal management of circuit boards | Hyunsuk Chun | 2022-08-16 |
| 11385281 | Heat spreaders for use in semiconductor device testing, such as burn-in testing | Amy R. Griffin, Hyunsuk Chun | 2022-07-12 |
| 11372043 | Heat spreaders for use in semiconductor device testing, such as burn-in testing | Amy R. Griffin, Wesley J. Orme | 2022-06-28 |
| 11348875 | Semiconductor devices with flexible connector array | Koustav Sinha | 2022-05-31 |
| 11348857 | Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture | — | 2022-05-31 |
| 11270924 | Heat spreaders for multiple semiconductor device modules | — | 2022-03-08 |
| 11239133 | Apparatus and method for dissipating heat in multiple semiconductor device modules | Shams U. Arifeen | 2022-02-01 |