Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410962 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2022-08-09 |
| 11410963 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2022-08-09 |
| 11309285 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Owen R. Fay, Chan H. Yoo | 2022-04-19 |
| 11264360 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2022-03-01 |
| 11239206 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2022-02-01 |