Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11392035 | Gap filling composition and pattern forming method using composition containing polymer | Xiaowei Wang | 2022-07-19 |
| 11260431 | Substrate processing method and substrate processing apparatus | Yukifumi YOSHIDA, Manabu OKUTANI, Shuichi Yasuda, Yasunori Kanematsu, Dai Ueda +2 more | 2022-03-01 |