Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380640 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Byeung Soo SONG | 2022-07-05 |
| 11292315 | Air conditioning device for vehicle and method of controlling the same | Jae Won Heo, Jin Han Kim | 2022-04-05 |
| 11233000 | Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package | Do-Young Kim, Jin Won Jeong, Hye Ji Lee | 2022-01-25 |