Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380640 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380640 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jin Won Jeong, Jae Sik Choi | 2022-07-05 |