Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380640 | Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die | Jae Sik Choi, Byeung Soo SONG | 2022-07-05 |
| 11238405 | Electronic apparatus and operation method thereof | Da Young Kim, Sang Min Jun, Kyeong Suk Jin, Woo Jung Park | 2022-02-01 |
| 11233000 | Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package | Jae Sik Choi, Do-Young Kim, Hye Ji Lee | 2022-01-25 |