Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233000 | Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package | Jae Sik Choi, Do-Young Kim, Jin Won Jeong | 2022-01-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233000 | Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package | Jae Sik Choi, Do-Young Kim, Jin Won Jeong | 2022-01-25 |