Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508712 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2022-11-22 |
| 11424180 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Seungjae Lee, Se Woong Cha +4 more | 2022-08-23 |
| 11292315 | Air conditioning device for vehicle and method of controlling the same | Jae Won Heo, Jae Sik Choi | 2022-04-05 |