Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508712 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2022-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508712 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2022-11-22 |