Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527496 | Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2022-12-13 |
| 11515174 | Semiconductor devices with package-level compartmental shielding and associated systems and methods | Youngik Kwon | 2022-11-29 |
| 11501978 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2022-11-15 |
| 11456289 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2022-09-27 |
| 11424180 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2022-08-23 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jungbae Lee | 2022-06-14 |