Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532595 | Stacked semiconductor dies for semiconductor device assemblies | — | 2022-12-20 |
| 11404289 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Chih-Hong Wang | 2022-08-02 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jong Sik Paek | 2022-06-14 |
| 11342277 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | — | 2022-05-24 |
| 11264349 | Semiconductor die with capillary flow structures for direct chip attachment | — | 2022-03-01 |