Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527496 | Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof | Jong Sik Paek, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2022-12-13 |
| 11501978 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2022-11-15 |
| 11424155 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2022-08-23 |