Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424155 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2022-08-23 |
| 11335643 | Embedded ball land substrate, semiconductor package, and manufacturing methods | Corey Reichman | 2022-05-17 |
| 11289451 | Semiconductor package with high routing density patch | Michael Kelly, David Jon Hiner | 2022-03-29 |
| 11244923 | Semiconductor device and manufacturing method thereof | — | 2022-02-08 |