Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424155 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2022-08-23 |
| 11289451 | Semiconductor package with high routing density patch | Michael Kelly, Ronald Patrick Huemoeller | 2022-03-29 |