Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335643 | Embedded ball land substrate, semiconductor package, and manufacturing methods | Ronald Patrick Huemoeller | 2022-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335643 | Embedded ball land substrate, semiconductor package, and manufacturing methods | Ronald Patrick Huemoeller | 2022-05-17 |