Issued Patents 2022
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |
| 11262019 | Display apparatus | Byungmin Woo, Chulyong Cho, Soonsuk SEO, Jaeneung Lee | 2022-03-01 |
| 11257786 | Semiconductor package including molding member, heat dissipation member, and reinforcing member | Sunchul Kim, Kyungsuk Oh, Pyoungwan Kim | 2022-02-22 |
| 11259359 | Method for managing connection of UE for transmitting and receiving V2X message in wireless communication system, and apparatus therefor | Laeyoung Kim, Dongsoo Kim | 2022-02-22 |
| 11259208 | Overload control method in wireless communication system and device for same | Jaehyun Kim, Jinsook Ryu, Hyunjung Choe | 2022-02-22 |
| 11252726 | Method and apparatus for reselecting Tx carrier for sidelink transmission in wireless communication system | Youngdae Lee | 2022-02-15 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong +1 more | 2022-02-08 |
| 11240719 | Handover method in wireless communication system and apparatus therefor | Sangmin Park, Myungjune YOUN, Hyunsook Kim, Jinsook Ryu | 2022-02-01 |