Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482507 | Semiconductor package having molding member and heat dissipation member | Sunchul Kim, Kyungsuk Oh, Taehun Kim, Soohwan Lee | 2022-10-25 |
| 11309228 | Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same | Sunchul Kim, Taehun Kim | 2022-04-19 |
| 11257786 | Semiconductor package including molding member, heat dissipation member, and reinforcing member | Sunchul Kim, Kyungsuk Oh, Taehun Kim | 2022-02-22 |