Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482507 | Semiconductor package having molding member and heat dissipation member | Sunchul Kim, Kyungsuk Oh, Taehun Kim, Pyoungwan Kim | 2022-10-25 |
| 11425583 | Network data collection method from application function device for network data analytic function | Myung Ki SHIN, Seung-Ik LEE | 2022-08-23 |
| 11388070 | Method and system for providing service experience analysis based on network data analysis | Myung Ki SHIN | 2022-07-12 |
| 11381494 | Method and system for providing communication analysis of user equipment based on network data analysis | Myung Ki SHIN | 2022-07-05 |