Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443975 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2022-09-13 |
| 11286560 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Nishanth Manjunath | 2022-03-29 |