Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen, Guanping Wu +2 more | 2022-12-13 |
| 11482532 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Wenguang Shi, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2022-10-25 |
| 11462474 | Three-dimensional memory devices having a plurality of NAND strings | Jifeng Zhu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2022-10-04 |
| 11380701 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Qian Tao, Yushi Hu +5 more | 2022-07-05 |
| 11309327 | Method for forming channel hole plug of three-dimensional memory device | Li Xiao, Qian Tao, Yushi Hu, Jun Chen, Longdong Liu +1 more | 2022-04-19 |
| 11289611 | Three dimensional memory | Hongbin Zhu, Gordon A. Haller, Roger W. Lindsay, Andrew Bicksler, Brian Cleereman +1 more | 2022-03-29 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2022-03-15 |
| 11271004 | Memory device and forming method thereof | Yue Qiang Pu, Jin Wen Dong, Jun Chen, Qian Tao, Yushi Hu +5 more | 2022-03-08 |
| 11264397 | Source structure of three-dimensional memory device and method for forming the same | Yushi Hu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2022-03-01 |