Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489049 | Integrated assemblies, and methods of forming integrated assemblies | — | 2022-11-01 |
| 11348939 | Integrated assemblies, and methods of forming integrated assemblies | Collin Howder | 2022-05-31 |
| 11289611 | Three dimensional memory | Zhenyu Lu, Hongbin Zhu, Roger W. Lindsay, Andrew Bicksler, Brian Cleereman +1 more | 2022-03-29 |