Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li | 2022-04-12 |
| 11264306 | Hybrid TIMs for electronic package cooling | Kamal K. Sikka, Piyas Bal Chowdhury, James J. Kelly, Jeffrey A. Zitz, Shidong Li | 2022-03-01 |