Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11393745 | Semiconductor packages with embedded interconnects | Kyu Oh Lee, Dilan Seneviratne | 2022-07-19 |