Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532532 | Composite media protection for pressure sensor | — | 2022-12-20 |
| 11498829 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Scott M. Hayes, Julien Juéry | 2022-11-15 |
| 11456227 | Topside heatsinking antenna launcher for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2022-09-27 |
| 11404288 | Semiconductor device packaging warpage control | Scott M. Hayes, Zhiwei Gong, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Scott M. Hayes, Zhiwei Gong, Stephen R. Hooper | 2022-05-17 |
| 11276654 | Bottom-side heatsinking waveguide for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2022-03-15 |