Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498829 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Michael B. Vincent, Julien Juéry | 2022-11-15 |
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Zhiwei Gong, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Zhiwei Gong, Stephen R. Hooper | 2022-05-17 |