Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Vivek Gupta | 2022-08-02 |
| 11222790 | Tie bar removal for semiconductor device packaging | Rushik P. Tank, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2022-01-11 |