Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Scott M. Hayes, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Scott M. Hayes, Stephen R. Hooper | 2022-05-17 |
| 11297246 | Photography control method, device, non-transitory storage medium and system of intelligent photography system | Yu Lu, Bin Chen, Yong Li, Yuni Chen, Xinyu Ye +1 more | 2022-04-05 |
| 11245854 | Intelligent photography system | Wenming Tang, Bin Chen, Yong Li, Yu Lu, Yuni Chen +3 more | 2022-02-08 |
| 11222790 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Burton J. Carpenter, Jinmei Liu | 2022-01-11 |