Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498829 | No-gel pressure sensor package | Mark E. Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry | 2022-11-15 |
| 11482478 | Shielded electronic package and method of fabrication | Crispulo Estira Lictao, JR., Chayathorn Saklang, Amornthep Saiyajitara, Chanon Suwankasab, Bernd Offermann | 2022-10-25 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong | 2022-05-17 |