Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more | 2022-10-25 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more | 2022-07-05 |