Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502049 | Package comprising multi-level vertically stacked redistribution portions | Aniket PATIL, David Fraser Rae | 2022-11-15 |
| 11456291 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Marcus HSU, Aniket PATIL | 2022-09-27 |
| 11444019 | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package | Aniket PATIL, Kuiwon Kang | 2022-09-13 |
| 11393808 | Ultra-low profile stacked RDL semiconductor package | Aniket PATIL, David Fraser Rae | 2022-07-19 |
| 11342246 | Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices | Aniket PATIL, Jonghae Kim | 2022-05-24 |
| 11302656 | Passive device orientation in core for improved power delivery in package | Aniket PATIL, Joan Rey Villarba BUOT, Zhijie Wang | 2022-04-12 |
| 11296024 | Nested interconnect structure in concentric arrangement for improved package architecture | Aniket PATIL, Jonghae Kim | 2022-04-05 |
| 11296022 | Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape | Aniket PATIL, Joan Rey Villarba BUOT | 2022-04-05 |
| 11289453 | Package comprising a substrate and a high-density interconnect structure coupled to the substrate | Aniket PATIL, Zhijie Wang | 2022-03-29 |
| 11258165 | Asymmetric antenna structure | Chin-Kwan Kim, Jaehyun Yeon, Suhyung Hwang | 2022-02-22 |