Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502049 | Package comprising multi-level vertically stacked redistribution portions | Aniket PATIL, Hong Bok We | 2022-11-15 |
| 11404343 | Package comprising a substrate configured as a heat spreader | John Holmes, Marcus HSU, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |
| 11393808 | Ultra-low profile stacked RDL semiconductor package | Aniket PATIL, Hong Bok We | 2022-07-19 |