Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh | 2022-12-20 |
| 11386030 | Connection interface conversion chip, connection interface conversion device and operation method | Cheng-Chung Lin, Hsiao-Chyi Lin, Yi-Shing Lin | 2022-07-12 |