CL

Cheng-Chung Lin

TSMC: 1 patents #1,889 of 3,577Top 55%
VL Via Labs: 1 patents #1 of 13Top 8%
Overall (2022): #170,660 of 548,613Top 35%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11386030 Connection interface conversion chip, connection interface conversion device and operation method Hsiao-Chyi Lin, Yi-Shing Lin, Chien-Sheng Chen 2022-07-12
11270052 System and method of timing characterization for semiconductor circuit Chia Hao Tu, Hsueh-Chih Chou, Sang Hoo Dhong, Jerry Chang Jui Kao, Chi-Lin Liu +1 more 2022-03-08