Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264338 | Integrated circuit package with through void guard trace | Ananth Prabhakumar, Krishna Srinivasan | 2022-03-01 |
| 11257743 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Sujit Sharan, Dae-Woo Kim | 2022-02-22 |
| 11257745 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Veronica Strong, Kristof Darmawikarta | 2022-02-22 |