Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482621 | Vertically stacked CMOS with upfront M0 interconnect | Willy Rachmady, Patrick Morrow, Aaron D. Lilak, Rishabh Mehandru, Cheng-Ying Huang +4 more | 2022-10-25 |
| 11328988 | Top gate recessed channel CMOS thin film transistor in the back end of line and methods of fabrication | Gilbert Dewey, Cory Bomberger, Cheng-Ying Huang, Ashish Agrawal, Willy Rachmady +1 more | 2022-05-10 |
| 11244943 | Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material | Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Kimin Jun, Willy Rachmady +5 more | 2022-02-08 |