Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535949 | Substrate holder and plating apparatus | Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake | 2022-12-27 |
| 11447885 | Plating method and plating apparatus | Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto | 2022-09-20 |
| 11385125 | Leak check method, leak check apparatus, plating method, and plating apparatus | Kiyoshi Suzuki | 2022-07-12 |
| 11371155 | Method and apparatus for processing a substrate | Takahisa Okuzono | 2022-06-28 |
| 11359304 | Powder supply apparatus and plating system | Shao Hua Chang | 2022-06-14 |
| 11315812 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Yuji Araki, Tensei Sato, Ryuya Koizumi | 2022-04-26 |
| 11230789 | Method of removing liquid from seal of a substrate holder | Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake | 2022-01-25 |