Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11461647 | Method of constructing prediction model that predicts number of plateable substrates, method of constructing selection model for predicting component that causes failure, and method of predicting number of plateable substrates | Kunio Oishi, Masashi Shimoyama | 2022-10-04 |
| 11315812 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Jumpei Fujikata, Yuji Araki, Tensei Sato | 2022-04-26 |
| 11286577 | Plating method and plating apparatus | Masashi Shimoyama, Mizuki Nagai | 2022-03-29 |