Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11459652 | Techniques and device structures based upon directional dielectric deposition and bottom-up fill | M. Arif Zeeshan, Tristan Y. Ma | 2022-10-04 |
| 11404314 | Metal line patterning | Sony Varghese, M. Arif Zeeshan, Shantanu Kallakuri | 2022-08-02 |
| 11289374 | Nucleation-free gap fill ALD process | Yihong Chen, Xinliang Lu, Srinivas Gandikota, Yong Wu, Susmit Singha Roy +1 more | 2022-03-29 |