Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11459652 | Techniques and device structures based upon directional dielectric deposition and bottom-up fill | Tristan Y. Ma, Kelvin Chan | 2022-10-04 |
| 11404314 | Metal line patterning | Sony Varghese, Shantanu Kallakuri, Kelvin Chan | 2022-08-02 |