Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-12-21 |
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Xianjin Wan | 2021-11-16 |
| 11145666 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2021-10-12 |
| 11101276 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Jifeng Zhu, Zhenyu Lu, Jun Chen, Xiaowang Dai, Lan Yao +4 more | 2021-08-24 |
| 11056387 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2021-07-06 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-06-29 |