Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Yuan Li, Si Ping Hu, Xianjin Wan | 2021-11-16 |
| 11126328 | Application processing method and apparatus, storage medium, and computing device | Yanjia Chi, Wei Li, Xialun Lai, Leteng Weng, Hao Chen +8 more | 2021-09-21 |
| D926150 | Mobile phone | Bin Xie, Hungyi Huang, Qian Wang, Junxuan Chen, Qichong Wei +2 more | 2021-07-27 |