Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Si Ping Hu, Xianjin Wan | 2021-11-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Si Ping Hu, Xianjin Wan | 2021-11-16 |