Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Si Ping Hu | 2021-11-16 |
| 10910397 | Through array contact structure of three- dimensional memory device | Zhenyu Lu, Wenguang Shi, Guanping Wu, Baoyou Chen | 2021-02-02 |
| 10886291 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Wenguang Shi, Guanping Wu, Feng Pan, Baoyou Chen | 2021-01-05 |