Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2021-12-21 |
| 11094714 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2021-08-17 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2021-06-29 |