Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11137559 | Optical chip package and method for forming the same | Jiun-Yen LAI, Yu-Ting Huang, Hsing-Lung SHEN, Hui-Hsien Wu | 2021-10-05 |
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2021-09-14 |
| 11107759 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Jiun-Yen LAI, Hsing-Lung SHEN | 2021-08-31 |
| 10950738 | Chip package and method for forming the same | Shu-Ming Chang | 2021-03-16 |