Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107759 | Chip package and manufacturing method thereof | Jiun-Yen LAI, Hsing-Lung SHEN, Tsang-Yu Liu | 2021-08-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107759 | Chip package and manufacturing method thereof | Jiun-Yen LAI, Hsing-Lung SHEN, Tsang-Yu Liu | 2021-08-31 |