Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu | 2021-09-14 |
| 11056427 | Chip package | Chia-Ming Cheng | 2021-07-06 |