Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11137559 | Optical chip package and method for forming the same | Jiun-Yen LAI, Yu-Ting Huang, Hsing-Lung SHEN, Tsang-Yu Liu | 2021-10-05 |
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2021-09-14 |