Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11212912 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Benito Joseph Rodriguez, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2021-12-28 |
| 11164853 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2021-11-02 |
| 10950738 | Chip package and method for forming the same | Tsang-Yu Liu | 2021-03-16 |